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Call For Papers: Special Issue on Democratizing Microelectronics: Open-Source Tools and Chiplet-Enabled Prototyping

IEEE Computer seeks submissions for this upcoming special issue.

Important Dates

  • Submissions deadline: 1 August 2026
  • Publication: April 2027

Open-source hardware ecosystems and chiplet-based design methodologies are fundamentally changing who can innovate in microelectronics, how quickly, and at what cost. Open process development kits (PDKs), community-supported design tools, and reusable architectural components are lowering barriers that once restricted hardware innovation to well-funded corporations and elite institutions. Chiplet-based integration enables modular system prototyping at scales ranging from academic research to commercial products, with standardized interfaces dramatically reducing time-to-prototype and non-recurring engineering costs. This transformation is further accelerated by government investments worldwide, which explicitly prioritize accessible research ecosystems, workforce development, supply chain resilience, and secure hardware innovation.

This special issue of IEEE Computer seeks articles that capture this transformation for a broad technical audience. We are interested in contributions that go beyond describing individual tools or projects to examine how openness and modularity are reshaping research methodologies, educational approaches, innovation cycles, and industry dynamics. Rather than focusing on narrowly scoped technical optimizations, contributions should emphasize system-level perspectives, design methodologies, practical experiences, and lessons learned. The goal is to help the broader computing community understand why these changes matter, what becomes possible, and what technical, economic, and security challenges remain.

We welcome submissions from academia, industry, government laboratories, and open-source communities. Relevant contributions may include, but are not limited to:

  • Open-source processors, accelerators, and reusable architectural components
  • Chiplet-based system design, modular integration, and heterogeneous platforms
  • Chiplet interconnect standards and advanced packaging (2.5D/3D integration)
  • Open-source electronic design automation (EDA), computer-aided design tools, interoperable toolchains, libraries, and PDKs
  • Artificial intelligence and machine learning (AI/ML)-driven design automation, optimization, and verification methodologies
  • Data standards, benchmarking frameworks, and reproducibility in ML-enhanced EDA
  • Verification, testing, reliability, and security methodologies for open and chiplet-based systems, including supply-chain trust, hardware provenance, and compositional security
  • End-to-end prototyping infrastructures spanning FPGA, ASIC, and PCB platforms
  • Full-system simulation and hardware–software co-design environments
  • Open PDKs and multi-project wafer (MPW) programs enabling broad research access
  • Case studies and experience reports from open hardware platforms and research testbeds
  • Ecosystem perspectives on sustainability, community building, governance, and technology transfer
  • Economics of chiplet-based prototyping and cost reduction strategies
  • Educational approaches leveraging open hardware and modular design

Submission Guidelines:

For author information and guidelines on submission criteria, visit the Author’s Information Page. Please submit papers through the IEEE Author Portal and be sure to select the special issue or special section name. Manuscripts should not be published or currently submitted for publication elsewhere. Please submit only full papers intended for review, not abstracts.

Articles should be written for a broad technical audience and focus on clarity, insight, and impact. Submissions that combine technical depth with practical relevance and cross-disciplinary perspectives are particularly encouraged. All submissions will undergo peer review consistent with the editorial standards of IEEE Computer Magazine.

In addition to submitting your paper to Computer, you are also encouraged to upload the data related to your paper to IEEE DataPort. IEEE DataPort is IEEE's data platform that supports the storage and publishing of datasets while also providing access to thousands of research datasets. Uploading your dataset to IEEE DataPort will strengthen your paper and will support research reproducibility. Your paper and the dataset can be linked, providing a good opportunity for you to increase the number of citations you receive. Data can be uploaded to IEEE DataPort prior to submitting your paper or concurrent with the paper submission. Thank you!


Guest Editors

  • Antonino Tumeo , PNNL, USA
  • Andrew Kahng, UCSD, USA
  • Cristina Silvano, Politecnico di Milano, Italy
  • Jeffrey Voas, NIST, USA
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