Call For Papers: IEEE Reliability, Availability, and Serviceability (RAS) in Automotive Summit

Conference Overview

Join us for a new international summit focused on the automotive industry, where academic researchers and industry leaders will collaborate to address the toughest Reliability, Availability, and Serviceability (RAS) challenges facing the automotive market now and in the future. This is a free, two-day summit located in Torino, Italy, at the Polytechnic University of Turin. This summit emphasizes end-use and market-ready solutions. Sponsored by the IEEE Computer Society in collaboration with the Test Technology Technical Community (TTTC), RAS in Automotive aims to foster innovation and collaboration in the field.

Learn More

• Submission deadline: 25 October 2024 2 November 2024
• Notification of Acceptance: 12 November 2024
• Conference date: 5-6 December 2024

Paper Submittals

We invite you to participate and submit your contributions to the RAS Summit. Areas of interest include (but are not limited to):

Automotive Design-for-Test: Enable high quality at low cost

• Built-In Self-Test in automotive systems: Digital, analog, mixed-signal
• Power-up, power-down and periodic test

Dependability Challenges: Addressing autonomous driving and e-mobility

• Aging effects on automotive electronics
• Fault tolerance and self-checking circuits

Functional Safety and Cybersecurity

• Aging effects on automotive electronics
• Fault tolerance and self-checking circuits

Verification and Validation: Ensuring automotive systems reliability

• Statistical post-processing
• Machine Learning, and AI for testing and reliability

Reuse of Test Infrastructure: Accelerating New Product Development

• Statistical post-processing
• Machine Learning, and AI for testing and reliability

Monitoring Silicon Lifecycle Management

• Statistical post-processing
• Machine Learning, and AI for testing and reliability

Advanced Packaging and Chiplet Technology

• Packaging Equipment and Test Equipment
• Reliability of Systems in Package

Reliability of Power Modules for Automotive

• Design for Test and Reliability of power modules
• Reliability Analysis and ISO Standardizations

Reliability of AI Architectures for Automotive

• Design for Test of AI HW Accelerators
• Reliability assessment of AI computations

Submit A Paper

Submission Guidelines

We welcome submissions of regular contributions or special session proposals:

Regular Papers

• Format: 1-page abstract
• Content: Describe a single work addressing a relevant topic for the summit.

Special Sessions

• Format: 1-page abstract
• Content: Describe a specific special session, which may include a panel discussion or a set of three related contributions on a relevant topic.

Review Process

Submitted abstracts will be reviewed by a committee of renowned experts in the field. Shortlisted authors are required to attend the workshop in person for oral presentation(s).

Bonus: On 4 December, we will be hosting a F2F combined standards plenary meeting for IEEE P2851 and IEEE FSSC, immediately preceding the RAS in Automotive Summit. Indicate your interest by completing the sign-up form.

In addition to submitting your paper to IEEE RAS, you are also encouraged to upload the data related to your paper to IEEE DataPort. IEEE DataPort is IEEE's data platform that supports the storage and publishing of datasets while also providing access to thousands of research datasets. Uploading your dataset to IEEE DataPort will strengthen your paper and will support research reproducibility. Your paper and the dataset can be linked, providing a good opportunity for you to increase the number of citations you receive. Data can be uploaded to IEEE DataPort prior to submitting your paper or concurrent with the paper submission. Thank you!

Access the sign-up form here