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Call for Submissions: IEEE Quantum Week 2026

Conference dates: 13-18 September 2026 | Toronto, Ontario, Canada

IEEE Quantum Week brings together the global quantum community across research, education, industry, and government to advance quantum computing and engineering. Quantum Week is an exceptionally collaborative hub for the global quantum ecosystem, advancing quantum computing and engineering through research, education, industry and government engagement.

Learn More


Why Participate?

  • Share your work with international experts and peers, and gain valuable feedback

Opportunities

  • Present your emerging ideas and applications
  • Showcase your demos of innovative systems, tools, prototypes, and interactive experiences
  • Utilize your platform to share new advances, ideas, and solutions
  • Highlight your contributions
  • Contribute to event programming and technical content
  • Experience groundbreaking workshops, special sessions, and panels

Topics

  • Quantum Computing
  • Quantum Systems Engineering
  • Quantum Applications
  • Quantum Algorithms & Information
  • Quantum Systems Software
  • Quantum Photonics & Optics
  • Quantum Machine Learning (QML)
  • Quantum Generative AI
  • Quantum Software Engineering
  • Distributed Quantum Computing
  • Quantum Communications & Cryptography
  • Quantum Sensing & Metrology
  • Quantum Education & Training

Submit Your Content

In addition to submitting your paper to IEEE Hot Chips 2026, you are also encouraged to upload the data related to your paper to IEEE DataPort.  IEEE DataPort is IEEE’s data platform that supports the storage and publishing of datasets while also providing access to thousands of research datasets. Uploading your dataset to IEEE DataPort will strengthen your paper and will support research reproducibility.  Your paper and the dataset can be linked, providing a good opportunity for you to increase the number of citations you receive.  Data can be uploaded to IEEE DataPort prior to submitting your paper or concurrent with the paper submission.  Thank you!

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