Call for Submissions: IEEE COOL Chips 2026
Conference dates: 15-17 April 2026 | Tokyo, Japan
IEEE Symposium on Low-Power and High-Speed Chips and Systems (COOL Chips) was initiated in 1998 to present the advancement of low-power and high-speed chips and systems. The symposium covers leading-edge technologies in all areas of microprocessors and their applications.
Why Participate?
- Share your work with international experts and peers, and gain valuable feedback
Opportunities
- Present your emerging ideas and applications
- Showcase your demos of innovative systems, tools, prototypes, and interactive experiences
- Utilize your platform to share new advances, ideas, and solutions
- Highlight your contributions
- Contribute to event programming and technical content
- Experience groundbreaking workshops, special sessions, and panels
Topics
- Low Power-High Performance Processors for AI, IoT, Multimedia, Digital Consumer Electronics, Mobile, Graphics, Encryption, Robotics, Automotive, Networking, Medical, Healthcare, and Biometrics.
- Novel Architectures and Schemes for Single Core, Multi/Many-Core, NoC, Embedded Systems, Reconfigurable Computing, Grid, Ubiquitous, Dependable Computing, GALS and 3D Integration.
- Cool Software including Parallel Schedulers, Embedded Real-time Operating System, Binary Translations, Compiler Issues and Low Power Application Techniques.
In addition to submitting your paper to IEEE COOL Chips 2026, you are also encouraged to upload the data related to your paper to IEEE DataPort. IEEE DataPort is IEEE’s data platform that supports the storage and publishing of datasets while also providing access to thousands of research datasets. Uploading your dataset to IEEE DataPort will strengthen your paper and will support research reproducibility. Your paper and the dataset can be linked, providing a good opportunity for you to increase the number of citations you receive. Data can be uploaded to IEEE DataPort prior to submitting your paper or concurrent with the paper submission. Thank you!
